A method for fabricating an optical assembly by placing a flexible portion of a substrate, including a waveguide, upon a horizontally movable stage of a flip-chip bonder. Then moving a clamp through an opening in the stage to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position and vertically downwardly moving a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide and mounting the optical component to the substrate edge. Then releasing the optical component from the bond head while moving the clamp downward through the stage opening and unbending the flexible portion of the substrate with the optical component mounted thereon.