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公开(公告)号：US10734787B2
公开(公告)日：2020-08-04
申请号：US16396279
申请日：2019-04-26
发明人： Charles Caër , Lukas Czornomaz , Stefan Abel , Bert Jan Offrein
IPC分类号： H01S5/20 , H01S5/30 , H01S5/026 , H01S5/227 , H01S5/10 , H01S5/125 , H01S5/343 , H01S5/042 , G02B6/12 , H01S5/14 , H01S5/02
摘要： Embodiments of the disclosure are directed to a lateral current injection electro-optical device. The device comprises an active region with a stack of III-V semiconductor gain materials stacked along a stacking direction z. The active region may be formed as a slab having several lateral surface portions, each extending parallel to the stacking direction z. The device further comprises two paired elements, which include: a pair of doped layers of III-V semiconductor materials (an n-doped layer and a p-doped layer); and a pair of lateral waveguide cores. The two paired elements may be laterally arranged, two-by-two, on opposite sides of the slab. The elements distinctly adjoin respective ones of the lateral surface portions of the slab, so as for these elements to be separated from each other by the slab. The disclosure may be further directed to related silicon photonics devices and fabrication methods.
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公开(公告)号：US09864134B2
公开(公告)日：2018-01-09
申请号：US14442240
申请日：2013-11-27
CPC分类号： G02B6/12004 , H01L27/14 , H01L31/18 , Y02P70/521
摘要： A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes a processed semiconductor substrate. The processed semiconductor substrate includes active electronic components. The semiconductor structure also includes a dielectric layer that covers, at least partially, the processed semiconductor substrate. An interface layer that is suitable for growing optically active material on the interface layer is bonded to the dielectric layer. An optical gain layer and the processed semiconductor substrate are connected through the dielectric layer by electric and/or optical contacts.
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公开(公告)号：US09274289B2
公开(公告)日：2016-03-01
申请号：US13676351
申请日：2012-11-14
IPC分类号： G02B6/36 , G02B6/42 , G02B6/43 , H05K1/02 , G02B6/13 , H05K13/00 , G02B6/38 , H05K1/18 , H05K3/34 , G02B6/12
CPC分类号： G02B6/42 , G02B6/13 , G02B6/3885 , G02B6/4214 , G02B6/43 , G02B2006/12166 , H05K1/0274 , H05K1/184 , H05K1/189 , H05K3/3405 , H05K13/00 , H05K2201/09081 , H05K2201/10121 , H05K2201/10674 , H05K2203/0195 , Y10T29/49002 , Y10T29/49037 , Y10T29/49124 , Y10T29/49826 , Y10T29/53
摘要： Embodiments provide a horizontally movable stage, with an opening, of a flip-chip bonder, a substrate including at least one flexible portion and a waveguide, the waveguide exposed at one end edge of the substrate positioned upon the stage with the end edge over the opening, a vertically upwardly movable clamp sized to penetrate the stage opening and positioned underneath the stage, a vertically downwardly movable bond head above the stage opening, an optical component positioned in the head, a glue dispenser positioned to provide glue to either a mating surface of the substrate exposed end edge or a mating surface of the optical component, and a controller connected to the stage, clamp, head and dispenser, including a control circuit for positioning the substrate waveguide exposed end edge underneath the optical component while dispensing glue for fixably bonding the mating surfaces of the optical component and the substrate exposed end edge.
摘要翻译： 实施例提供了具有倒装芯片连接器的开口的水平移动平台，包括至少一个柔性部分和波导的基板，该波导在位于台面上的基板的一个端部边缘处露出，端部边缘超过 开口，垂直向上可移动的夹具，其大小适于穿透平台开口并且定位在平台下方，在平台开口上方具有垂直向下可移动的接合头，定位在头部中的光学部件，定位成将胶水提供给配合表面 衬底暴露的端边缘或光学部件的配合表面，以及连接到平台，夹具，头部和分配器的控制器，包括用于将衬底波导暴露的端部边缘定位在光学部件下方的控制电路，同时分配用于可固定的胶 粘合光学部件的配合表面和基板暴露的端部边缘。
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公开(公告)号：US20230118621A1
公开(公告)日：2023-04-20
申请号：US17451550
申请日：2021-10-20
摘要： A method of processing data and related apparatuses. The method relies on an optical finite impulse response (FIR) filter. This optical FIR filter comprises several delay stages having weights set in accordance with parameters of a transformation to be applied by the optical FIR filter. Each of the delay stages is configured to impose a delay matched to a given input data period corresponding to a given input sample rate. According to the method, an optical signal is coupled into the optical FIR filter. The optical signal carries a data stream of input samples encoded at the given input sample rate; the data stream represents the data to be processed. Next, output samples are collected from an output data stream carried by an output optical signal obtained in output of the optical FIR filter. A set of output samples are obtained, which are representative of processed data.
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公开(公告)号：US11615843B2
公开(公告)日：2023-03-28
申请号：US17124648
申请日：2020-12-17
摘要： Embodiments of the present invention provide a computer system, a voltage resistance controlling apparatus, and a method that comprises at least two electrodes on proximal endpoints; a first layer disposed on the at least two electrodes, wherein the first layer is a made of a metal-oxide; a second layer disposed on the second layer, wherein the second first layer is made of an electrically conductive metal-oxide; a forming contact disposed on the second layer, wherein a combination of the forming contact disposed on the first layer disposed on the second layer operatively connects the at least two electrodes; and a computer system operatively connected to the forming contact, wherein the computer system is configured to apply a predetermined voltage to the first layer and the second layer respectively and display an overall resistance increase using a user interface.
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公开(公告)号：US20220278274A1
公开(公告)日：2022-09-01
申请号：US17189173
申请日：2021-03-01
发明人： Bert Jan Offrein , Valeria Bragaglia , Folkert Horst , Antonio La Porta , Roger F. Dangel , Daniel S. Jubin
摘要： An electrical memristive device has a layer structure. The later structure comprises two electrodes and a bilayer material arrangement that connects the two electrodes. The bilayer material arrangement may, for example, be sandwiched by the two electrodes, in direct contact therewith. The bilayer material arrangement includes an HfOy layer, where 1.3±0.1≤y
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公开(公告)号：US20190252859A1
公开(公告)日：2019-08-15
申请号：US16396279
申请日：2019-04-26
发明人： Charles Caër , Lukas Czornomaz , Stefan Abel , Bert Jan Offrein
摘要： Embodiments of the disclosure are directed to a lateral current injection electro-optical device. The device comprises an active region with a stack of III-V semiconductor gain materials stacked along a stacking direction z. The active region may be formed as a slab having several lateral surface portions, each extending parallel to the stacking direction z. The device further comprises two paired elements, which include: a pair of doped layers of III-V semiconductor materials (an n-doped layer and a p-doped layer); and a pair of lateral waveguide cores. The two paired elements may be laterally arranged, two-by-two, on opposite sides of the slab. The elements distinctly adjoin respective ones of the lateral surface portions of the slab, so as for these elements to be separated from each other by the slab. The disclosure may be further directed to related silicon photonics devices and fabrication methods.
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公开(公告)号：US08926197B2
公开(公告)日：2015-01-06
申请号：US13676319
申请日：2012-11-14
IPC分类号： G02B6/36 , G02B6/42 , G02B6/43 , H05K1/02 , H05K1/18 , G02B6/13 , H05K13/00 , G02B6/38 , H05K3/34 , G02B6/12
CPC分类号： G02B6/42 , G02B6/13 , G02B6/3885 , G02B6/4214 , G02B6/43 , G02B2006/12166 , H05K1/0274 , H05K1/184 , H05K1/189 , H05K3/3405 , H05K13/00 , H05K2201/09081 , H05K2201/10121 , H05K2201/10674 , H05K2203/0195 , Y10T29/49002 , Y10T29/49037 , Y10T29/49124 , Y10T29/49826 , Y10T29/53
摘要： A method for fabricating an optical assembly by placing a flexible portion of a substrate, including a waveguide, upon a horizontally movable stage of a flip-chip bonder. Then moving a clamp through an opening in the stage to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position and vertically downwardly moving a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide and mounting the optical component to the substrate edge. Then releasing the optical component from the bond head while moving the clamp downward through the stage opening and unbending the flexible portion of the substrate with the optical component mounted thereon.
摘要翻译： 一种通过将包括波导的基板的柔性部分放置在倒装芯片连接器的水平移动台上来制造光学组件的方法。 然后将夹具移动到阶段中的开口以弯曲基板的柔性部分，以将波导暴露端放置在大致垂直的位置，并垂直向下移动包含光学部件的接合头在波导暴露的基板边缘上以将光学 部件与暴露的波导并将光学部件安装到基板边缘。 然后在将夹具向下移动穿过平台开口并且将基板的柔性部分与安装在其上的光学部件相互弯曲的同时从结合头释放光学部件。
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公开(公告)号：US20140208571A1
公开(公告)日：2014-07-31
申请号：US14243075
申请日：2014-04-02
IPC分类号： G02B6/42
CPC分类号： G02B6/42 , G02B6/13 , G02B6/3885 , G02B6/4214 , G02B6/43 , G02B2006/12166 , H05K1/0274 , H05K1/184 , H05K1/189 , H05K3/3405 , H05K13/00 , H05K2201/09081 , H05K2201/10121 , H05K2201/10674 , H05K2203/0195 , Y10T29/49002 , Y10T29/49037 , Y10T29/49124 , Y10T29/49826 , Y10T29/53
摘要： A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
摘要翻译： 倒装式连接器通过水平地定位包括波导的基板的柔性部分来制造光学组件，波导在基板的一个端部边缘处露出; 弯曲柔性基板的一部分以将波导暴露端放置在大致垂直的位置; 将包含光学部件的接合头垂直地定位在波导暴露的衬底边缘上以将光学部件与暴露的波导光学匹配; 并将光学部件可固定地安装到基板边缘。
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公开(公告)号：US11070029B2
公开(公告)日：2021-07-20
申请号：US16396317
申请日：2019-04-26
发明人： Charles Caer , Lukas Czornomaz , Stefan Abel , Bert Jan Offrein
IPC分类号： H01S5/30 , H01S5/026 , H01S5/227 , H01S5/10 , H01S5/125 , H01S5/343 , H01S5/042 , H01S5/20 , G02B6/12 , H01S5/14 , H01S5/02
摘要： Embodiments are directed to the fabrication of an electro-optical device. The device comprises the forming of an active region with a stack of III-V semiconductor gain materials stacked along a stacking direction z. The active region may be formed as a slab having several lateral surface portions, each extending parallel to the stacking direction z. The device further comprises selectively re-growing two paired elements, which include: a pair of doped layers of III-V semiconductor materials (an n-doped layer and a p-doped layer); and a pair of lateral waveguide cores. The two paired elements may be laterally arranged, two-by-two, on opposite sides of the slab. The elements distinctly adjoin respective ones of the lateral surface portions of the slab, so as for these elements to be separated from each other by the slab. The disclosure may be further directed to related silicon photonics devices.
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