Invention Grant
- Patent Title: Encapsulating sheet, light emitting diode device, and producing method thereof
- Patent Title (中): 封装片，发光二极管装置及其制造方法
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Application No.: US13784013Application Date: 2013-03-04
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Publication No.: US08937329B2Publication Date: 2015-01-20
- Inventor: Hiroyuki Katayama
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-049032 20120306
- Main IPC: H01L33/54
- IPC: H01L33/54 ; H01L33/50 ; H01L33/56
Abstract:
An encapsulating sheet includes a transparent layer in which a concave portion that is dented from the surface inwardly is formed and a phosphor encapsulating layer which fills the concave portion. The transparent layer is formed from a transparent composition containing a first silicone resin composition and the phosphor encapsulating layer is formed from a phosphor encapsulating composition containing a phosphor and a second silicone resin composition.
Public/Granted literature
- US20130234186A1 ENCAPSULATING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF Public/Granted day:2013-09-12
Information query
IPC分类:
