发明授权
- 专利标题： Mechanical resonating structures including a temperature compensation structure
- 专利标题（中）： 包括温度补偿结构的机械谐振结构
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申请号： US13313511申请日： 2011-12-07
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公开(公告)号： US08937425B2公开(公告)日： 2015-01-20
- 发明人: David M. Chen , Jan H. Kuypers , Alexei Gaidarzhy , Guiti Zolfagharkhani
- 申请人： David M. Chen , Jan H. Kuypers , Alexei Gaidarzhy , Guiti Zolfagharkhani
- 申请人地址： US MA Cambridge
- 专利权人： Sand 9, Inc.
- 当前专利权人： Sand 9, Inc.
- 当前专利权人地址： US MA Cambridge
- 代理机构： Wolf, Greenfield & Sacks, P.C.
- 主分类号： H03H9/02
- IPC分类号： H03H9/02
摘要：
Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations. The compensating structure may have multiple layers, one of which may have a stiffness that increases with increasing temperature and one of which may have a stiffness that decreases with increases in temperature.
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