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公开(公告)号：US20110187227A1
公开(公告)日：2011-08-04
申请号：US12899447
申请日：2010-10-06
IPC分类号： H01L41/107 , H01L41/18 , H01L41/047 , H01L41/053 , H01L41/22
CPC分类号： H03H3/007 , H03H9/02007 , H03H9/02244 , H03H9/02535
摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。
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公开(公告)号：US20100181868A1
公开(公告)日：2010-07-22
申请号：US12639260
申请日：2009-12-16
申请人： Alexei Gaidarzhy , Jan H. Kuypers , David M. Chen , Guiti Zolfagharkhani , Pritiraj Mohanty , Reimund Rebel , Klaus Juergen Schoepf
发明人： Alexei Gaidarzhy , Jan H. Kuypers , David M. Chen , Guiti Zolfagharkhani , Pritiraj Mohanty , Reimund Rebel , Klaus Juergen Schoepf
IPC分类号： H01L41/047
CPC分类号： H03H9/0095 , H03H9/02102 , H03H9/02228
摘要： Multi-port devices having multiple electrical ports are described, as are related methods. Some of the multi-port devices may have two input ports and two output ports, and may be driven differentially, in a single-ended mode, in a single-ended to differential mode, or in a differential to single-ended mode. The multi-port devices may include one or more transducers coupled to the electrical ports.
摘要翻译： 具有多个电端口的多端口设备也被描述为相关方法。 一些多端口设备可以具有两个输入端口和两个输出端口，并且可以以单端模式，单端到差分模式或差分到单端模式在差分地驱动。 多端口设备可以包括耦合到电端口的一个或多个换能器。
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3.发明授权公开(公告)号：US08937425B2
公开(公告)日：2015-01-20
申请号：US13313511
申请日：2011-12-07
IPC分类号： H03H9/02
CPC分类号： H03H9/02834 , H03H9/02102 , H03H9/02228 , H03H9/02448 , H03H9/02574
摘要： Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations. The compensating structure may have multiple layers, one of which may have a stiffness that increases with increasing temperature and one of which may have a stiffness that decreases with increases in temperature.
摘要翻译： 描述了机械谐振结构，以及相关的装置和方法。 机械谐振结构可以具有用于补偿温度变化的补偿结构。 补偿结构可以具有多个层，其中之一可以具有随着温度升高而增加的刚度，并且其中的一个可以具有随温度升高而降低的刚度。
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公开(公告)号：US20130200752A1
公开(公告)日：2013-08-08
申请号：US13367745
申请日：2012-02-07
IPC分类号： H01L41/04
CPC分类号： H03H9/02259 , H03H9/02 , H03H9/2463 , H03H2009/02251 , H03H2009/241
摘要： Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.
摘要翻译： 描述机械谐振结构及相关方法。 与常规谐振结构相比，机械谐振结构可提供改进的效率。 一些结构具有长度和宽度，并且被设计成在大致平行于长度或宽度的方向上振动。 它们可以具有限定长度和宽度尺寸的边界，其可以基本上与振动的节点或反节点对齐。
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公开(公告)号：US20120056510A9
公开(公告)日：2012-03-08
申请号：US12899447
申请日：2010-10-06
IPC分类号： H01L41/107 , H01L41/22 , H01L41/053 , H01L41/18 , H01L41/047
CPC分类号： H03H3/007 , H03H9/02007 , H03H9/02244 , H03H9/02535
摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。
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6.发明授权公开(公告)号：US08058769B2
公开(公告)日：2011-11-15
申请号：US12639161
申请日：2009-12-16
IPC分类号： H01L41/04
CPC分类号： H03H9/02834 , H03H9/02102 , H03H9/02228 , H03H9/02448 , H03H9/02574
摘要： Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.
摘要翻译： 描述了机械谐振结构，以及相关的装置和方法。 机械谐振结构可以具有用于补偿温度变化的补偿结构。
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公开(公告)号：US20100314969A1
公开(公告)日：2010-12-16
申请号：US12732575
申请日：2010-03-26
申请人： Alexei Gaidarzhy , Jan H. Kuypers , David M. Chen , Guiti Zolfagharkhani , Pritiraj Mohanty , Klaus Juergen Schoepf , Behraad Bahreyni
发明人： Alexei Gaidarzhy , Jan H. Kuypers , David M. Chen , Guiti Zolfagharkhani , Pritiraj Mohanty , Klaus Juergen Schoepf , Behraad Bahreyni
IPC分类号： H01L41/04
CPC分类号： H03H9/02338 , H03H9/02433 , H03H2009/0244
摘要： Apparatus and methods of connecting mechanical resonating structures to a body are described. Multi-element anchors may include a flexible portion that flexes when the mechanical resonating structure vibrates. The flexible portion may have a length related to the resonance frequency of the mechanical resonating structures. Some of the multi-element anchors include elements that are oriented perpendicularly to each other. MEMS incorporating such structures are also described.
摘要翻译： 描述了将机械谐振结构连接到主体的装置和方法。 多元件锚可以包括当机械共振结构振动时弯曲的柔性部分。 柔性部分可以具有与机械谐振结构的谐振频率相关的长度。 一些多元件锚定件包括彼此垂直取向的元件。 还描述了结合这种结构的MEMS。
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公开(公告)号：US08766512B2
公开(公告)日：2014-07-01
申请号：US12750768
申请日：2010-03-31
IPC分类号： H01L41/053
CPC分类号： H03H3/007 , H03H9/02007 , H03H9/02244 , H03H9/02535
摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。
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公开(公告)号：US08661899B2
公开(公告)日：2014-03-04
申请号：US13038000
申请日：2011-03-01
IPC分类号： G01C19/56
CPC分类号： G01C19/56 , G01C19/5712
摘要： An apparatus is described that includes a substrate having a first plate and a second plate. The first plate and the second plate collectively have a first mode when excited by a drive signal and have a second mode when excited by a gyroscopic effect. The first and second plates each include a temperature-compensated stack having first and third layers that have a stiffness that increases with increasing temperature over a temperature range with a second layer between the first and third layers, where the second layer is formed from a different material than the first and third layers.
摘要翻译： 描述了一种包括具有第一板和第二板的基板的装置。 当由驱动信号激励时，第一板和第二板共同具有第一模式，并且当由陀螺效应激励时具有第二模式。 第一和第二板各自包括温度补偿堆叠，其具有第一和第三层，其具有在温度范围内随着温度升高而增加的刚度，第一和第三层之间的第二层在第一和第三层之间，其中第二层由不同的 材料比第一和第三层。
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公开(公告)号：US20120049980A1
公开(公告)日：2012-03-01
申请号：US13290405
申请日：2011-11-07
IPC分类号： H03H9/17
CPC分类号： H03H9/02834 , H03H9/02102 , H03H9/02228 , H03H9/02448 , H03H9/02574
摘要： Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.
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