Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.