发明授权
- 专利标题： Through hole vias at saw streets including protrusions or recesses for interconnection
- 专利标题（中）： 通道通道，包括用于互连的突起或凹槽
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申请号： US13273537申请日： 2011-10-14
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公开(公告)号： US08940636B2公开(公告)日： 2015-01-27
- 发明人: Reza A. Pagaila , Zigmund R. Camacho , Lionel Chien Hui Tay , Byung Tai Do
- 申请人： Reza A. Pagaila , Zigmund R. Camacho , Lionel Chien Hui Tay , Byung Tai Do
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC, Ltc.
- 当前专利权人： STATS ChipPAC, Ltc.
- 当前专利权人地址： SG Singapore
- 代理机构： Patent Law Group: Atkins and Associates, P.C.
- 代理商 Robert D. Atkins
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/683 ; H01L21/56 ; H01L23/31 ; H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L25/10 ; H01L25/00
摘要：
A semiconductor package includes a semiconductor wafer having a plurality of semiconductor die. A contact pad is formed over and electrically connected to an active surface of the semiconductor die. A gap is formed between the semiconductor die. An insulating material is deposited in the gap between the semiconductor die. An adhesive layer is formed over a surface of the semiconductor die and the insulating material. A via is formed in the insulating material and the adhesive layer. A conductive material is deposited in the via to form a through hole via (THV). A conductive layer is formed over the contact pad and the THV to electrically connect the contact pad and the THV. The plurality of semiconductor die is singulated. The insulating material can include an organic material. The active surface of the semiconductor die can include an optical device.
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