Invention Grant
US08946033B2 Merged fin finFET with (100) sidewall surfaces and method of making same
有权
具有(100)侧壁表面的合并翅片finFET及其制造方法
- Patent Title: Merged fin finFET with (100) sidewall surfaces and method of making same
- Patent Title (中): 具有(100)侧壁表面的合并翅片finFET及其制造方法
-
Application No.: US13561352Application Date: 2012-07-30
-
Publication No.: US08946033B2Publication Date: 2015-02-03
- Inventor: Thomas N. Adam , Keith E. Fogel , Jinghong Li , Alexander Reznicek
- Applicant: Thomas N. Adam , Keith E. Fogel , Jinghong Li , Alexander Reznicek
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Joseph Petrokaitis
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L29/78

Abstract:
A merged fin finFET and method of fabrication. The finFET includes: two or more single-crystal semiconductor fins on a top surface of an insulating layer on semiconductor substrate, each fin of the two or more fins having a central region between and abutting first and second end regions and opposite sides, top surfaces and sidewalls of the two or more fins are (100) surfaces and the longitudinal axes of the two or more fins aligned with a [100] direction; a gate dielectric layer on each fin of the two or more fins; an electrically conductive gate over the gate dielectric layer over the central region of each fin of the of two or more fins; and a merged source/drain comprising an a continuous layer of epitaxial semiconductor material on ends of each fin of the two or more fins, the ends on a same side of the conductive gate.
Public/Granted literature
- US20140027863A1 MERGED FIN FINFET WITH (100) SIDEWALL SURFACES AND METHOD OF MAKING SAME Public/Granted day:2014-01-30
Information query
IPC分类: