Invention Grant
US08950063B2 Methods of manufacturing printed circuit boards with stacked micro vias
有权
制造具有堆叠微通孔的印刷电路板的方法
- Patent Title: Methods of manufacturing printed circuit boards with stacked micro vias
- Patent Title (中): 制造具有堆叠微通孔的印刷电路板的方法
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Application No.: US12938265Application Date: 2010-11-02
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Publication No.: US08950063B2Publication Date: 2015-02-10
- Inventor: Raj Kumar , Monte Dreyer , Michael J. Taylor
- Applicant: Raj Kumar , Monte Dreyer , Michael J. Taylor
- Applicant Address: US MO St. Louis
- Assignee: Viasystems Technologies Corp., L.L.C.
- Current Assignee: Viasystems Technologies Corp., L.L.C.
- Current Assignee Address: US MO St. Louis
- Agency: Polsinelli PC
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H05K3/46 ; H05K3/40 ; H05K3/20 ; H05K3/38 ; H05K3/42
Abstract:
A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.
Public/Granted literature
- US20110041330A1 METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO VIAS Public/Granted day:2011-02-24
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