发明授权
- 专利标题： Methods of forming solder balls in semiconductor packages
- 专利标题（中）： 在半导体封装中形成焊球的方法
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申请号： US13931295申请日： 2013-06-28
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公开(公告)号： US08951834B1公开(公告)日： 2015-02-10
- 发明人: Kyung Moon Kim , Il Kwon Shim , HeeJo Chi , HanGil Shin
- 申请人： Kyung Moon Kim , Il Kwon Shim , HeeJo Chi , HanGil Shin
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; G01R31/26 ; H01L21/66 ; H01L23/02 ; H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/56
摘要：
Methods of forming solder balls for semiconductor packages using film-assisted molding include providing a substrate, forming a plurality of solder balls on the substrate where each solder ball has an initial profile, and coupling a substantially planar film to the solder balls. As an encapsulation is deposited over the substrate and around the solder balls, the substantially planar film and the encapsulation, along with the molding process, can cause each solder ball to morph from its initial profile to a final profile, where the final profile is generally different from the initial profile.
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