Invention Grant
US08952451B2 Semiconductor device having metal gate and manufacturing method thereof
有权
具有金属栅极的半导体器件及其制造方法
- Patent Title: Semiconductor device having metal gate and manufacturing method thereof
- Patent Title (中): 具有金属栅极的半导体器件及其制造方法
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Application No.: US14135588Application Date: 2013-12-20
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Publication No.: US08952451B2Publication Date: 2015-02-10
- Inventor: Po-Jui Liao , Tsung-Lung Tsai , Chien-Ting Lin , Shao-Hua Hsu , Yeng-Peng Wang , Chun-Hsien Lin , Chan-Lon Yang , Guang-Yaw Hwang , Shin-Chi Chen , Hung-Ling Shih , Jiunn-Hsiung Liao , Chia-Wen Liang
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L21/8238

Abstract:
A semiconductor device having a metal gate includes a substrate having a first gate trench and a second gate trench formed thereon, a gate dielectric layer respectively formed in the first gate trench and the second gate trench, a first work function metal layer formed on the gate dielectric layer in the first gate trench and the second gate trench, a second work function metal layer respectively formed in the first gate trench and the second gate trench, and a filling metal layer formed on the second work function metal layer. An opening width of the second gate trench is larger than an opening width of the first gate trench. An upper area of the second work function metal layer in the first gate trench is wider than a lower area of the second work function metal layer in the first gate trench.
Public/Granted literature
- US20140103443A1 SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-04-17
Information query
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