Invention Grant
- Patent Title: Arrangements for an integrated sensor
- Patent Title (中): 集成传感器的安排
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Application No.: US13918064Application Date: 2013-06-14
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Publication No.: US08952471B2Publication Date: 2015-02-10
- Inventor: Michael C. Doogue , William P. Taylor , Vijay Mangtani
- Applicant: Allegro Microsystems, LLC
- Applicant Address: US MA Worcester
- Assignee: Allegro Microsystems, LLC
- Current Assignee: Allegro Microsystems, LLC
- Current Assignee Address: US MA Worcester
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H01L29/82
- IPC: H01L29/82 ; H01L43/08 ; B82Y25/00 ; G01R15/20 ; G01R33/02 ; G01R33/07 ; G01R33/09 ; H01L25/16
Abstract:
An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
Public/Granted literature
- US20130277782A1 Arrangements For An Integrated Sensor Public/Granted day:2013-10-24
Information query
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