Leadless current sensor package with high isolation

    公开(公告)号:US12265103B2

    公开(公告)日:2025-04-01

    申请号:US17817796

    申请日:2022-08-05

    Abstract: A sensor package comprising a lead frame, a current sensor die, and an interposer. The lead frame includes: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads. The current sensor die includes one or more sensing elements. The current sensor die is configured to measure a level of electrical current through the primary conductor of the lead frame. The interposer is disposed over the layer of dielectric material. The interposer includes a plurality of conductive traces that are configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads.

    SIGNAL ISOLATOR HAVING INTERPOSER
    6.
    发明申请

    公开(公告)号:US20190067562A1

    公开(公告)日:2019-02-28

    申请号:US15689185

    申请日:2017-08-29

    Abstract: Methods and apparatus for a signal isolator having a dielectric interposer supporting first and second die each having a magnetic field sensing element. A first signal path extends from the first die to the second die and a second signal path extends from the second die to the first die. In embodiments, the first signal path is located in the interposer and includes a first coil to generate a magnetic field and the second signal path is located in the interposer and includes a second coil to generate a magnetic filed. The first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.

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