Invention Grant
- Patent Title: Semiconductor package and method for fabricating the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13647740Application Date: 2012-10-09
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Publication No.: US08952489B2Publication Date: 2015-02-10
- Inventor: Klaus Elian , Jens Pohl , Horst Theuss , Renate Hofmann , Alexander Glas , Carsten Ahrens
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/498 ; H01L23/495 ; H01L23/522 ; H01L23/29
Abstract:
A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material.
Public/Granted literature
- US20140097514A1 Semiconductor Package and Method for Fabricating the Same Public/Granted day:2014-04-10
Information query
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