Invention Grant
- Patent Title: Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
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Application No.: US12655975Application Date: 2010-01-12
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Publication No.: US08952550B2Publication Date: 2015-02-10
- Inventor: Madhav Datta , Dave Emory , Subhash M. Joshi , Susanne Menezes , Doowon Suh
- Applicant: Madhav Datta , Dave Emory , Subhash M. Joshi , Susanne Menezes , Doowon Suh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.
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