- 专利标题： Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
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申请号： US12655975申请日： 2010-01-12
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公开(公告)号： US08952550B2公开(公告)日： 2015-02-10
- 发明人: Madhav Datta , Dave Emory , Subhash M. Joshi , Susanne Menezes , Doowon Suh
- 申请人： Madhav Datta , Dave Emory , Subhash M. Joshi , Susanne Menezes , Doowon Suh
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.
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