Invention Grant
- Patent Title: Methods of fabricating semiconductor devices and underfill equipment for the same
- Patent Title (中): 制造半导体器件和底部填充设备的方法相同
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Application No.: US13835749Application Date: 2013-03-15
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Publication No.: US08956923B2Publication Date: 2015-02-17
- Inventor: Young-Ja Kim , Jun-Young Ko , Dae-Young Jeong , Dae-Sang Chan
- Applicant: Samsung Electronics Co, Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2012-0065100 20120618
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B05C13/02 ; B29C65/00 ; B05D5/12 ; H01L21/56
Abstract:
A method of fabricating a semiconductor device comprises loading a circuit board including a semiconductor chip into underfill equipment, positioning the circuit board on a depositing chuck of the underfill equipment, filling an underfill material in a space between the semiconductor chip and the circuit board placed on the depositing chuck; transferring the circuit board including the underfill material so that it is positioned on a post-treatment chuck of the underfill equipment; heating the underfill material of the circuit board placed on the post-treatment chuck in a vacuum state, and unloading the circuit board, of which the underfill material has been heated in the vacuum state, from the underfill equipment.
Public/Granted literature
- US20130337616A1 METHODS OF FABRICATING SEMICONDUCTOR DEVICES AND UNDERFILL EQUIPMENT FOR THE SAME Public/Granted day:2013-12-19
Information query
IPC分类:
