Invention Grant
US08957524B2 Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure
有权
用于封装集成电路产品的支柱结构和制造这种支柱结构的方法
- Patent Title: Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure
- Patent Title (中): 用于封装集成电路产品的支柱结构和制造这种支柱结构的方法
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Application No.: US13834058Application Date: 2013-03-15
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Publication No.: US08957524B2Publication Date: 2015-02-17
- Inventor: Dirk Breuer , Frank Kuechenmeister , Jens Paul , Kashi Vishwanath Machani
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L23/00
Abstract:
One illustrative pillar disclosed herein includes a bond pad conductively coupled to an integrated circuit and a pillar comprising a base that is conductively coupled to the bond pad, wherein the base has a first lateral dimension, and an upper portion that is conductively coupled to the base, wherein the upper portion has a second lateral dimension that is less than the first lateral dimension. A method disclosed herein of forming a pillar includes forming a base such that it is conductively coupled to a bond pad on an integrated circuit product and, after forming the base, forming an upper portion such that it is conductively coupled to the base.
Public/Granted literature
Information query
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