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1.发明申请NOVEL PILLAR STRUCTURE FOR USE IN PACKAGING INTEGRATED CIRCUIT PRODUCTS AND METHODS OF MAKING SUCH A PILLAR STRUCTURE 有权用于包装集成电路产品的新型支柱结构和制造这种支柱结构的方法公开(公告)号：US20140264890A1
公开(公告)日：2014-09-18
申请号：US13834058
申请日：2013-03-15
Applicant: GLOBALFOUNDRIES INC.
Inventor： Dirk Breuer , Frank Kuechenmeister , Jens Paul , Kashi Vishwanath Machani
IPC: H01L23/488 , H01L23/00
CPC classification number: H01L24/11 , H01L23/3192 , H01L24/13 , H01L2224/0401 , H01L2224/05005 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/1146 , H01L2224/11474 , H01L2224/11849 , H01L2224/11906 , H01L2224/13005 , H01L2224/13007 , H01L2224/13014 , H01L2224/13017 , H01L2224/13022 , H01L2224/1308 , H01L2224/13084 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2924/12042 , H01L2924/351 , H01L2924/3512 , H01L2924/00014 , H01L2924/01047 , H01L2924/207 , H01L2924/00
Abstract: One illustrative pillar disclosed herein includes a bond pad conductively coupled to an integrated circuit and a pillar comprising a base that is conductively coupled to the bond pad, wherein the base has a first lateral dimension, and an upper portion that is conductively coupled to the base, wherein the upper portion has a second lateral dimension that is less than the first lateral dimension. A method disclosed herein of forming a pillar includes forming a base such that it is conductively coupled to a bond pad on an integrated circuit product and, after forming the base, forming an upper portion such that it is conductively coupled to the base.
Abstract translation: 本文公开的一个说明性支柱包括导电耦合到集成电路的接合焊盘和包括导体耦合到接合焊盘的基座的支柱，其中基部具有第一横向尺寸，并且导电耦合到基座 ，其中所述上部具有小于所述第一横向尺寸的第二横向尺寸。 本文公开的形成柱的方法包括形成基底，使得其与集成电路产品上的接合焊盘导电耦合，并且在形成基底之后，形成上部，使得其与基底导电耦合。
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2.发明授权Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure 有权用于封装集成电路产品的支柱结构和制造这种支柱结构的方法公开(公告)号：US08957524B2
公开(公告)日：2015-02-17
申请号：US13834058
申请日：2013-03-15
Applicant: GLOBALFOUNDRIES Inc.
Inventor： Dirk Breuer , Frank Kuechenmeister , Jens Paul , Kashi Vishwanath Machani
IPC: H01L23/488 , H01L23/00
CPC classification number: H01L24/11 , H01L23/3192 , H01L24/13 , H01L2224/0401 , H01L2224/05005 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/1146 , H01L2224/11474 , H01L2224/11849 , H01L2224/11906 , H01L2224/13005 , H01L2224/13007 , H01L2224/13014 , H01L2224/13017 , H01L2224/13022 , H01L2224/1308 , H01L2224/13084 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2924/12042 , H01L2924/351 , H01L2924/3512 , H01L2924/00014 , H01L2924/01047 , H01L2924/207 , H01L2924/00
Abstract: One illustrative pillar disclosed herein includes a bond pad conductively coupled to an integrated circuit and a pillar comprising a base that is conductively coupled to the bond pad, wherein the base has a first lateral dimension, and an upper portion that is conductively coupled to the base, wherein the upper portion has a second lateral dimension that is less than the first lateral dimension. A method disclosed herein of forming a pillar includes forming a base such that it is conductively coupled to a bond pad on an integrated circuit product and, after forming the base, forming an upper portion such that it is conductively coupled to the base.
Abstract translation: 本文公开的一个说明性支柱包括导电耦合到集成电路的接合焊盘和包括导体耦合到接合焊盘的基座的支柱，其中基部具有第一横向尺寸，并且导电耦合到基座 ，其中所述上部具有小于所述第一横向尺寸的第二横向尺寸。 本文公开的形成柱的方法包括形成基底，使得其与集成电路产品上的接合焊盘导电耦合，并且在形成基底之后，形成上部，使得其与基底导电耦合。
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