Invention Grant
- Patent Title: Integrated thermal spreading
- Patent Title (中): 集成散热
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Application No.: US13251108Application Date: 2011-09-30
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Publication No.: US08957577B2Publication Date: 2015-02-17
- Inventor: Stephen Brian Lynch , Fletcher R. Rothkopf , Scott Andrew Myers
- Applicant: Stephen Brian Lynch , Fletcher R. Rothkopf , Scott Andrew Myers
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agent Kendall P. Woodruff
- Main IPC: H01L51/50
- IPC: H01L51/50 ; H01L51/52 ; G06F1/20

Abstract:
Techniques are provided for removing thermal gradients from an organic light emitting diode (OLED) display. In one embodiment, an OLED display device includes a thermally conductive layer placed between electronic components housed within the device and the OLED display. Heat given off by the electronic components is transferred from warm to cold regions of the thermally conductive layer to create a more uniform ambient temperature across the back of the OLED display. Some embodiments indicate a position of the thermally conductive layer within layers of an OLED display stack (e.g., between a glass substrate and polyimide layer). Some embodiments include a specific range of thermal conductivities and/or thicknesses desired for the thermally conductive layer.
Public/Granted literature
- US20130082908A1 INTEGRATED THERMAL SPREADING Public/Granted day:2013-04-04
Information query
IPC分类: