Invention Grant
- Patent Title: Motion transmission module with a cooling device
- Patent Title (中): 运动传动模块带冷却装置
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Application No.: US14049405Application Date: 2013-10-09
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Publication No.: US08960038B2Publication Date: 2015-02-24
- Inventor: Yueh-Ling Chiu , Jonus Liu
- Applicant: Hiwin Technologies Corp.
- Applicant Address: TW Taichung
- Assignee: Hiwin Technologies Corp.
- Current Assignee: Hiwin Technologies Corp.
- Current Assignee Address: TW Taichung
- Agency: Patent Office of Bang Shia
- Main IPC: F16H3/06
- IPC: F16H3/06 ; F16H27/02 ; F16H29/02 ; F16H29/20 ; F16H1/24 ; F16H55/02 ; F16H57/04 ; F16H25/22
Abstract:
A motion transmission module with a cooling device is aimed at solving the disadvantage of the conventional motion transmission module that the cooling structure of the conventional motion transmission module would increase the length or outer diameter of the nut. The nut is formed with a flat surface for mounting the cooling device, so that the length of the nut won't be increased. Furthermore, the cooling device also serves as a positioning block to fix the return member, it doesn't increase the outer diameter of the nut.
Public/Granted literature
- US20140033847A1 MOTION TRANSMISSION MODULE WITH A COOLING DEVICE Public/Granted day:2014-02-06
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