A sealant article useful for sealing a substrate surface having a first surface and a second surface is provided. The first surface comprises a deformable composition that is capable of conforming to a substrate surface when subjected to heat and/or pressure. The second surface of the sealant article has been at least partially cured by exposing said surface to an amount of radiation effective to induce at least partial curing of the second surface of the sealant article. Prior to such curing, the second surface also is comprised of the deformable composition. Such at least partial curing is effective to render the second surface less deformable than the first surface.