Invention Grant
- Patent Title: Underfill curing method using carrier
- Patent Title (中): 底部填充固化方法使用载体
-
Application No.: US13418868Application Date: 2012-03-13
-
Publication No.: US08962392B2Publication Date: 2015-02-24
- Inventor: Chin-Fu Kao , Jing-Cheng Lin , Jui-Pin Hung , Szu Wei Lu
- Applicant: Chin-Fu Kao , Jing-Cheng Lin , Jui-Pin Hung , Szu Wei Lu
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/56
Abstract:
A method includes bonding a carrier over a top die. The method further includes curing an underfill disposed between a substrate and the top die. The method further includes applying a force over the carrier during the curing. The method further includes removing the carrier from the top die.
Public/Granted literature
- US20130244378A1 UNDERFILL CURING METHOD USING CARRIER Public/Granted day:2013-09-19
Information query
IPC分类:
