发明授权
- 专利标题： Underfill curing method using carrier
- 专利标题（中）： 底部填充固化方法使用载体
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申请号： US13418868申请日： 2012-03-13
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公开(公告)号： US08962392B2公开(公告)日： 2015-02-24
- 发明人: Chin-Fu Kao , Jing-Cheng Lin , Jui-Pin Hung , Szu Wei Lu
- 申请人： Chin-Fu Kao , Jing-Cheng Lin , Jui-Pin Hung , Szu Wei Lu
- 申请人地址： TW
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman & Ham, LLP
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/56
摘要：
A method includes bonding a carrier over a top die. The method further includes curing an underfill disposed between a substrate and the top die. The method further includes applying a force over the carrier during the curing. The method further includes removing the carrier from the top die.
公开/授权文献
- US20130244378A1 UNDERFILL CURING METHOD USING CARRIER 公开/授权日：2013-09-19
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