Invention Grant
- Patent Title: Integrated circuits and systems and methods for producing the same
- Patent Title (中): 集成电路及其制造方法
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Application No.: US13690407Application Date: 2012-11-30
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Publication No.: US08963135B2Publication Date: 2015-02-24
- Inventor: Dmitri E. Nikonov , Robert L. Sankman , Raseong Kim , Jin Pan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Main IPC: H01L29/08
- IPC: H01L29/08 ; G06F19/00 ; H05K3/46 ; H05K1/00 ; H01L51/00 ; H01L27/06 ; H01L27/28

Abstract:
Three dimensional integrated circuits including semiconductive organic materials are described. In some embodiments, the three dimensional integrated circuits include one or more electronic components that include a semiconductive region formed of one or more semiconductive organic materials. The electronic components of the three dimensional integrated circuits may also include insulating regions formed from organic insulating materials, and conductive regions form from conductive materials. The three dimensional integrated circuits may be formed by an additive manufacturing process such as three dimensional printing. Apparatus and methods for producing and testing three dimensional integrated circuits are also described.
Public/Granted literature
- US20140152383A1 INTEGRATED CIRCUITS AND SYSTEMS AND METHODS FOR PRODUCING THE SAME Public/Granted day:2014-06-05
Information query
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