Invention Grant
US08963302B2 Stacked packaged integrated circuit devices, and methods of making same
有权
集成封装的集成电路器件及其制造方法
- Patent Title: Stacked packaged integrated circuit devices, and methods of making same
- Patent Title (中): 集成封装的集成电路器件及其制造方法
-
Application No.: US13898782Application Date: 2013-05-21
-
Publication No.: US08963302B2Publication Date: 2015-02-24
- Inventor: David J. Corisis , Chin Hui Chong , Choon Kuan Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/13 ; H01L23/24 ; H01L25/10 ; H01L23/00
Abstract:
A device is disclosed which includes a first packaged integrated circuit device, a second packaged integrated circuit device positioned above the first packaged integrated circuit device and a plurality of planar conductive members conductively coupling the first and second packaged integrated circuit devices to one another. A method is also disclosed which includes conductively coupling a plurality of extensions on a leadframe to each of a pair of stacked packaged integrated circuit devices and cutting the leadframe to singulate the extensions from one another.
Public/Granted literature
- US20130256853A1 STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME Public/Granted day:2013-10-03
Information query
IPC分类:
