发明授权
- 专利标题: Seam protected encapsulated array
- 专利标题(中): 接缝保护封装阵列
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申请号: US13563359申请日: 2012-07-31
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公开(公告)号: US08967230B2公开(公告)日: 2015-03-03
- 发明人: Rod Alan Grozdanich , Edward Robert Kaczmarek
- 申请人: Rod Alan Grozdanich , Edward Robert Kaczmarek
- 申请人地址: US WA Spokane
- 专利权人: Spokane Industries
- 当前专利权人: Spokane Industries
- 当前专利权人地址: US WA Spokane
- 代理机构: Lee & Hayes, PLLC
- 主分类号: B22D19/02
- IPC分类号: B22D19/02 ; F41H5/00 ; F41H5/04 ; F41H5/02
摘要:
Seam protected encapsulated arrays of solid ceramic elements are disclosed. Vulnerable seams between solid ceramic elements arranged adjacent to each other in encapsulated arrays of solid ceramic elements are protected by a seam protector arranged in-line with the vulnerable seams and fixed to the encapsulated array. A stiffener may be arranged in-line with the vulnerable seams and fixed to the encapsulated array opposite to the seam protector. The solid ceramic elements may be encapsulated in a barrier material to prevent the base metal from reacting with the ceramic material units during casting, and/or provide crush/compression protection during cooling.
公开/授权文献
- US20130284005A1 SEAM PROTECTED ENCAPSULATED ARRAY 公开/授权日:2013-10-31