Invention Grant
- Patent Title: Semiconductor light emitting element and method for producing the same
- Patent Title (中): 半导体发光元件及其制造方法
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Application No.: US13772562Application Date: 2013-02-21
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Publication No.: US08969898B2Publication Date: 2015-03-03
- Inventor: Masahiko Onishi , Shun Kitahama
- Applicant: Nichia Corporation
- Applicant Address: JP Anan-Shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-Shi
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2012-034939 20120221
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/40 ; H01L33/38 ; H01L33/44

Abstract:
In a method for producing a semiconductor light emitting device: a semiconductor lamination of first and second semiconductor layers having different conductive types is formed; a portion of the semiconductor lamination is removed to expose an area of a surface of the first semiconductor layer; a conductor layer connecting the first and second semiconductor layers is formed; a first electrode is formed on the exposed areas of the first semiconductor layer and a second electrode is formed on an upper surface of the second semiconductor layer; a barrier layer covering at least one of the first and second electrodes is formed; and a connection part in the conductor layer connecting the first and second semiconductor layers is removed.
Public/Granted literature
- US20130214320A1 SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR PRODUCING THE SAME Public/Granted day:2013-08-22
Information query
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