发明授权
US08971806B2 Wireless bus for intra-chip and inter-chip communication, including scalable wireless bus embodiments
有权
用于芯片内和芯片间通信的无线总线，包括可伸缩的无线总线实施例
- 专利标题： Wireless bus for intra-chip and inter-chip communication, including scalable wireless bus embodiments
- 专利标题（中）： 用于芯片内和芯片间通信的无线总线，包括可伸缩的无线总线实施例
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申请号： US12877723申请日： 2010-09-08
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公开(公告)号： US08971806B2公开(公告)日： 2015-03-03
- 发明人: Ahmadreza (Reza) Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
- 申请人： Ahmadreza (Reza) Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
- 申请人地址： US CA Irvine
- 专利权人： Broadcom Corporation
- 当前专利权人： Broadcom Corporation
- 当前专利权人地址： US CA Irvine
- 代理机构： Sterne, Kessler, Goldstein & Fox PLLC
- 主分类号： H04B7/00
- IPC分类号： H04B7/00 ; G06F13/42 ; H04B7/10 ; G06F13/364 ; H04W84/18
摘要：
Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.