Providing for testing of digital sequencing components of an integrated chip is described herein. By way of example, self-test procedures are provided for unidirectional integrated chips that have different sequence generation (e.g., transmission) and sequence monitoring (e.g., receiving) frequencies. A test logic component(s) can be added to an integrated chip to match the sequence generation frequency to the sequence monitoring frequency. This can facilitate self-testing of unidirectional sequence generating components, by modifying a generated sequence at a first datarate to be receivable at a second datarate, and directing the modified sequence to sequence monitoring components of the integrated chip configured to operate at the second datarate.