发明授权
- 专利标题: Substrate processing apparatus
- 专利标题(中): 基板加工装置
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申请号: US12897384申请日: 2010-10-04
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公开(公告)号: US08978670B2公开(公告)日: 2015-03-17
- 发明人: Junya Minamida , Issei Ueda , Yasuhiro Chouno , Osamu Kuroda , Kazuyoshi Eshima , Masahiro Yoshida , Satoshi Morita
- 申请人: Junya Minamida , Issei Ueda , Yasuhiro Chouno , Osamu Kuroda , Kazuyoshi Eshima , Masahiro Yoshida , Satoshi Morita
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Abelman, Frayne & Schwab
- 优先权: JP2009-232056 20091006
- 主分类号: B08B3/00
- IPC分类号: B08B3/00 ; H01L21/67
摘要:
Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.
公开/授权文献
- US20110079252A1 SUBSTRATE PROCESSING APPARATUS 公开/授权日:2011-04-07
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