发明授权
US08980424B2 Prepreg, metal-clad laminate, and printed circuit board 有权
预浸料,覆金属层压板和印刷电路板

Prepreg, metal-clad laminate, and printed circuit board
摘要:
Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 μm and a glass filler having an average particle diameter of 1.0 to 3.0 μm, a specific gravity of 2.3 to 2.6 g/cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.
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