发明授权
- 专利标题: Prepreg, metal-clad laminate, and printed circuit board
- 专利标题(中): 预浸料,覆金属层压板和印刷电路板
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申请号: US13700587申请日: 2011-05-31
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公开(公告)号: US08980424B2公开(公告)日: 2015-03-17
- 发明人: Shuuji Gouzu , Makoto Yanagida
- 申请人: Shuuji Gouzu , Makoto Yanagida
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2010-124325 20100531; JP2010-124326 20100531; JP2010-124327 20100531; JP2010-124328 20100531
- 国际申请: PCT/JP2011/062517 WO 20110531
- 国际公布: WO2011/152413 WO 20111208
- 主分类号: B32B5/16
- IPC分类号: B32B5/16 ; B32B18/00 ; H05K1/03 ; B32B15/08 ; B32B27/38 ; C08G59/08 ; C08G59/40 ; C08J5/24 ; B32B3/10 ; B32B15/092 ; C08L63/00 ; H05K3/02
摘要:
Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 μm and a glass filler having an average particle diameter of 1.0 to 3.0 μm, a specific gravity of 2.3 to 2.6 g/cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.
公开/授权文献
- US20130126218A1 PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD 公开/授权日:2013-05-23
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