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公开(公告)号：US20070287021A1
公开(公告)日：2007-12-13
申请号：US10591696
申请日：2005-03-04
CPC分类号： C08J5/24 , C08G59/504 , C08G73/1042 , C08G73/106 , C08G73/14 , C08K5/3445 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K1/0353 , H05K2201/0154 , Y10T428/12549 , Y10T428/249921 , Y10T428/249924 , Y10T428/249941 , Y10T428/249951 , C08L2666/20 , C08L2666/22
摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。
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公开(公告)号：US06338382B1
公开(公告)日：2002-01-15
申请号：US09639885
申请日：2000-08-17
IPC分类号： F28F2700
CPC分类号： F24F1/0007 , F24F3/166 , F24F2001/0048
摘要： In an air conditioner equipped with an air cleaner, a front panel is provided with three air inlets: a first air inlet located on the front face of the front panel, a second air inlet located on the top face thereof, and a third air inlet located therebetween. Each of the first and second air inlets has an opening/closing unit including louvers, and an air cleaner is arranged on the inside of the third air inlet. At the time of cooling/heating operation and at the time of dehumidifying operation, the first and second air inlets are opened and closed by the opening/closing unit, by which the amount of air passing through the air cleaner is changed, thereby utilizing the air cleaner effectively.
摘要翻译： 在配备有空气滤清器的空调机中，前面板设置有三个空气入口：位于前面板前表面上的第一空气入口，位于其顶面上的第二空气入口和第三空气入口 位于它们之间。 第一和第二空气入口中的每一个具有包括百叶窗的打开/关闭单元，并且空气净化器布置在第三空气入口的内侧。 在冷却/加热运转时，在除湿运转时，第一和第二空气入口由打开/关闭单元打开和关闭，由此通过空气滤清器的空气量被改变，从而利用 空气净化器有效。
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公开(公告)号：USD449095S1
公开(公告)日：2001-10-09
申请号：US29137561
申请日：2001-02-22
申请人： Makoto Yanagida , Tomohiro Nagayama
设计人： Makoto Yanagida , Tomohiro Nagayama
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公开(公告)号：US08980424B2
公开(公告)日：2015-03-17
申请号：US13700587
申请日：2011-05-31
申请人： Shuuji Gouzu , Makoto Yanagida
发明人： Shuuji Gouzu , Makoto Yanagida
IPC分类号： B32B5/16 , B32B18/00 , H05K1/03 , B32B15/08 , B32B27/38 , C08G59/08 , C08G59/40 , C08J5/24 , B32B3/10 , B32B15/092 , C08L63/00 , H05K3/02
CPC分类号： H05K1/0326 , B32B3/10 , B32B15/08 , B32B15/092 , B32B27/38 , C08G59/08 , C08G59/304 , C08G59/4071 , C08J5/24 , C08J2363/00 , C08K5/5313 , C08L63/00 , H05K1/0306 , H05K1/0366 , H05K3/022 , Y10T428/24802 , Y10T428/24917 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/252 , Y10T428/257 , Y10T428/31522 , Y10T428/31529
摘要： Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 μm and a glass filler having an average particle diameter of 1.0 to 3.0 μm, a specific gravity of 2.3 to 2.6 g/cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.
摘要翻译： 提供一种通过用树脂组合物浸渍基材而制备的预浸料，其中树脂组合物含有平均粒径为2.5-4.5μm的氢氧化铝和平均粒径为1.0-3.0μm的玻璃填料，比重 为2.3〜2.6g / cm 3，SiO 2含量为50〜65质量％ 相对于树脂组合物中的固体成分的总量，氢氧化铝和玻璃填料的配合量的总和为30〜50质量％。 根据上述预浸料，能够得到的是一种金属复合层压板，其中尽管使用二氧化硅等无机填料和氢氧化铝组合，但是无机填料均匀分散，加工性优异 并具有低热膨胀系数。
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公开(公告)号：US20100270059A1
公开(公告)日：2010-10-28
申请号：US11915097
申请日：2006-05-19
IPC分类号： H05K1/02
CPC分类号： H05K1/0281 , H05K1/0265 , H05K1/056 , H05K2201/0352 , H05K2201/09736
摘要： It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 μm, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 μm.
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的印刷电路板。 根据本发明的优选实施例的印刷电路板（40）具有基底（1），形成在柔性区域（36）中的导体（7）和形成为非柔性的导体（8,9）的结构 地区（46）。 形成在柔性区域（36）中的导体（7）的总厚度为1-30μm，形成在非柔性区域（46）中的导体（8,9）的总厚度为30-150μm 。
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公开(公告)号：US20100065313A1
公开(公告)日：2010-03-18
申请号：US11916090
申请日：2006-05-26
IPC分类号： H05K1/14
CPC分类号： H05K3/4691 , H05K1/0278 , H05K1/0366 , H05K3/281 , H05K3/4611 , H05K3/4626 , H05K3/4688 , H05K2203/0571 , H05K2203/063
摘要： It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的多层电路板。 根据本发明的优选实施例，多层电路板（12）具有其中非柔性印刷电路板（6）通过盖板（10）层叠到柔性印刷电路板（1）的两侧上的结构。 在多层电路板（12）中，盖板（10）保护印刷电路板（6）不在其上的印刷电路板（1）的区域，同时还用作粘合层（11），用于与 印刷电路板（6）。 换句话说，相同的层用作多层电路板（12）中的覆盖层（10）和粘合剂层（11）。
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7.发明申请公开(公告)号：US20080302558A1
公开(公告)日：2008-12-11
申请号：US12180384
申请日：2008-07-25
CPC分类号： C08J5/24 , C08G59/504 , C08G73/1042 , C08G73/106 , C08G73/14 , C08K5/3445 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K1/0353 , H05K2201/0154 , Y10T428/12549 , Y10T428/249921 , Y10T428/249924 , Y10T428/249941 , Y10T428/249951 , C08L2666/20 , C08L2666/22
摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。
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公开(公告)号：US5636009A
公开(公告)日：1997-06-03
申请号：US662280
申请日：1996-06-12
申请人： Takao Honda , Tsuyoshi Watanabe , Tadashi Ishikawa , Masanori Muramatsu , Isamu Sato , Makoto Yanagida , Fumihiro Arahira , Takeo Yamamoto
发明人： Takao Honda , Tsuyoshi Watanabe , Tadashi Ishikawa , Masanori Muramatsu , Isamu Sato , Makoto Yanagida , Fumihiro Arahira , Takeo Yamamoto
IPC分类号： G03G15/00 , G03G15/02 , G03G15/043 , G03G21/00
CPC分类号： G03G15/751 , G03G15/0266 , G03G15/043 , G03G2215/021
摘要： An image forming apparatus includes a movable image bearing member, having a photosensitive layer; an image forming device for forming an image on the image bearing member: a charging member for charging the image bearing member; and a light radiating device for radiating light on the image bearing member; a detector for detecting a datum rotating to a thickness of the photosensitive layer on the basis of the voltage-current characteristic between the charging member and image bearing member; and a controller for controlling the amount of light radiated from the light radiating device to be increased with decrease in the thickness of the photosensitive layer, in response to the detector.
摘要翻译： 图像形成装置包括具有感光层的可动图像承载部件; 图像形成装置，用于在图像承载部件上形成图像;充电部件，用于对图像承载部件充电; 以及用于在图像承载部件上照射光的光辐射装置; 检测器，用于基于充电构件和图像承载构件之间的电压 - 电流特性来检测旋转到感光层的厚度的基准; 并且响应于检测器，用于控制从光辐射装置辐射的光量随着感光层厚度的减小而增加的控制器。
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9.发明授权Image forming apparatus having contact member capable of contacting with image bearing member 失效具有能够与图像承载部件接触的接触部件的图像形成装置
公开(公告)号：US5532799A
公开(公告)日：1996-07-02
申请号：US266305
申请日：1994-06-27
CPC分类号： G03G15/08 , G03G2215/1652
摘要： The present invention provides an image forming apparatus with an image forming device for forming a developer image on a recording material, an applicator for applying developer to form an image on an image bearing member to form a developer bearing area. A length of the developer bearing area in the generatrix direction of the image bearing member is longer than a maximum image width on the image bearing member in the generatrix direction thereof.
摘要翻译： 本发明提供了一种具有用于在记录材料上形成显影剂图像的图像形成装置的图像形成装置，用于在图像承载部件上施加显影剂以形成图像以形成显影剂承载区域的涂布器。 图像承载部件的母线方向上的显影剂承载区域的长度比图像承载部件在母线方向上的最大图像宽度长。
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10.发明授权Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition 有权环氧树脂组合物和预浸料，支撑树脂膜，金属箔覆层压板和利用所述组合物的多层印刷电路板公开(公告)号：US09215803B2
公开(公告)日：2015-12-15
申请号：US13700561
申请日：2011-05-31
申请人： Makoto Yanagida , Shuuji Gouzu
发明人： Makoto Yanagida , Shuuji Gouzu
IPC分类号： H05K1/03 , C08G59/30 , B32B15/08 , B32B27/38 , C08G59/08 , C08G59/40 , C08J5/24 , B32B3/10 , B32B15/092 , C08L63/00 , H05K3/02 , C08K5/5313
CPC分类号： H05K1/0326 , B32B3/10 , B32B15/08 , B32B15/092 , B32B27/38 , C08G59/08 , C08G59/304 , C08G59/4071 , C08J5/24 , C08J2363/00 , C08K5/5313 , C08L63/00 , H05K1/0306 , H05K1/0366 , H05K3/022 , Y10T428/24802 , Y10T428/24917 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/252 , Y10T428/257 , Y10T428/31522 , Y10T428/31529
摘要： The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:
摘要翻译： 根据本发明的环氧树脂组合物含有（A）含磷固化剂和（B）环氧树脂，其中含磷固化剂（A）是由以下化学式（1）表示的磷化合物， ; 由化学式（1）中的R表示的有机基团具有两个或更多个酚羟基; 有机基团的分子量为190以上：
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