Invention Grant
- Patent Title: Chip package structure and method for forming the same
- Patent Title (中): 芯片封装结构及其形成方法
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Application No.: US13548663Application Date: 2012-07-13
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Publication No.: US08981497B2Publication Date: 2015-03-17
- Inventor: Ho-Yin Yiu , Chien-Hung Liu , Tsang-Yu Liu , Ying-Nan Wen , Yen-Shih Ho
- Applicant: Ho-Yin Yiu , Chien-Hung Liu , Tsang-Yu Liu , Ying-Nan Wen , Yen-Shih Ho
- Applicant Address: TW Taoyuan
- Assignee: Xintec Inc.
- Current Assignee: Xintec Inc.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L29/82 ; H01L29/84 ; B81B3/00 ; H01L27/146
Abstract:
A chip package structure and a method for forming the chip package structure are disclosed. At least a block is formed on a surface of a cover, the cover is mounted on a substrate having a sensing device formed thereon for covering the sensing device, and the block is disposed between the cover and the sensing device. In the present invention, the block is mounted on the cover, there is no need to etch the cover to form a protruding portion, and thus the method of the present invention is simple and has low cost.
Public/Granted literature
- US20130020693A1 CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2013-01-24
Information query
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