CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    2.
    发明申请
    CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME 有权
    芯片包装结构及其形成方法

    公开(公告)号:US20130020693A1

    公开(公告)日:2013-01-24

    申请号:US13548663

    申请日:2012-07-13

    IPC分类号: H01L29/02 H01L21/50 H01L21/02

    摘要: A chip package structure and a method for forming the chip package structure are disclosed. At least a block is formed on a surface of a cover, the cover is mounted on a substrate having a sensing device formed thereon for covering the sensing device, and the block is disposed between the cover and the sensing device. In the present invention, the block is mounted on the cover, there is no need to etch the cover to form a protruding portion, and thus the method of the present invention is simple and has low cost.

    摘要翻译: 公开了一种用于形成芯片封装结构的芯片封装结构和方法。 至少一个块形成在盖的表面上,盖安装在其上形成有感测装置的基板上,用于覆盖感测装置,并且该块设置在盖和感测装置之间。 在本发明中,该块安装在盖上,不需要蚀刻盖以形成突出部分,因此本发明的方法简单且成本低。

    Chip package and method for forming the same
    9.
    发明授权
    Chip package and method for forming the same 有权
    芯片封装及其形成方法

    公开(公告)号:US09024437B2

    公开(公告)日:2015-05-05

    申请号:US13524985

    申请日:2012-06-15

    IPC分类号: H01L23/48 H01L21/78 H01L23/31

    摘要: An embodiment of the invention provides a chip package which includes: a substrate having a plurality of sides and a plurality of corner regions, wherein each of the corner regions is located at an intersection of at least two of the sides of the substrate; a device region formed in the substrate; a conducting layer disposed on the substrate and electrically connected to the device region; an insulating layer disposed between the substrate and the conducting layer; and a carrier substrate, wherein the substrate is disposed on the carrier substrate, and the substrate has a recess extending towards the carrier substrate in at least one of the corner regions.

    摘要翻译: 本发明的实施例提供一种芯片封装,其包括:具有多个侧面和多个拐角区域的基板,其中每个所述拐角区域位于所述基板的至少两个侧面的相交处; 形成在所述基板中的器件区域; 导电层,其设置在所述基板上并电连接到所述器件区域; 设置在所述基板和所述导电层之间的绝缘层; 以及载体基板,其中所述基板设置在所述载体基板上,并且所述基板具有在至少一个所述拐角区域中朝向所述载体基板延伸的凹部。

    Interposer and method for forming the same
    10.
    发明授权
    Interposer and method for forming the same 有权
    插入件及其形成方法

    公开(公告)号:US08692300B2

    公开(公告)日:2014-04-08

    申请号:US13360435

    申请日:2012-01-27

    IPC分类号: H01L29/40 H01L23/492

    摘要: An embodiment of the invention provides an interposer which includes: a substrate having a first surface and a second surface; a first hole extending from the first surface towards the second surface; a second hole extending from the first surface towards the second surface, wherein a width of the first hole is different from a width of the second hole; an insulating layer located on the substrate and extending onto a sidewall of the first hole and a sidewall of the second hole; and a conducting layer located on the insulating layer on the substrate and extending onto the sidewall of the first hole, wherein there is substantially no conducting layer in the second hole.

    摘要翻译: 本发明的实施例提供一种插入器,其包括:具有第一表面和第二表面的基板; 从所述第一表面朝向所述第二表面延伸的第一孔; 从所述第一表面朝向所述第二表面延伸的第二孔,其中所述第一孔的宽度与所述第二孔的宽度不同; 位于所述基板上并延伸到所述第一孔的侧壁和所述第二孔的侧壁上的绝缘层; 以及导电层,其位于所述基板上的所述绝缘层上并且延伸到所述第一孔的侧壁上,其中在所述第二孔中基本上没有导电层。