发明授权
- 专利标题： Chip package structure and method for forming the same
- 专利标题（中）： 芯片封装结构及其形成方法
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申请号： US13548663申请日： 2012-07-13
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公开(公告)号： US08981497B2公开(公告)日： 2015-03-17
- 发明人: Ho-Yin Yiu , Chien-Hung Liu , Tsang-Yu Liu , Ying-Nan Wen , Yen-Shih Ho
- 申请人： Ho-Yin Yiu , Chien-Hung Liu , Tsang-Yu Liu , Ying-Nan Wen , Yen-Shih Ho
- 申请人地址： TW Taoyuan
- 专利权人： Xintec Inc.
- 当前专利权人： Xintec Inc.
- 当前专利权人地址： TW Taoyuan
- 代理机构： Liu & Liu
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L29/82 ; H01L29/84 ; B81B3/00 ; H01L27/146
摘要：
A chip package structure and a method for forming the chip package structure are disclosed. At least a block is formed on a surface of a cover, the cover is mounted on a substrate having a sensing device formed thereon for covering the sensing device, and the block is disposed between the cover and the sensing device. In the present invention, the block is mounted on the cover, there is no need to etch the cover to form a protruding portion, and thus the method of the present invention is simple and has low cost.
公开/授权文献
- US20130020693A1 CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME 公开/授权日：2013-01-24
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