Invention Grant
US08981539B2 Packaged power semiconductor with interconnection of dies and metal clips on lead frame
有权
封装功率半导体，其引线框架上具有管芯和金属夹的互连
- Patent Title: Packaged power semiconductor with interconnection of dies and metal clips on lead frame
- Patent Title (中): 封装功率半导体，其引线框架上具有管芯和金属夹的互连
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Application No.: US13913717Application Date: 2013-06-10
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Publication No.: US08981539B2Publication Date: 2015-03-17
- Inventor: Yan Xun Xue , Hamza Yilmaz
- Applicant: Yan Xun Xue , Hamza Yilmaz
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: CH Emily LLC
- Agent Chein-Hwa Tsao
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L23/34 ; H01L23/12 ; H01L23/02
Abstract:
A power semiconductor device comprises a lead frame unit, a control die, a first MOSFET die and a second MOSFET die, wherein the lead frame unit comprises at least a die paddle for mounting the first and second MOSFET dies, a first pin and a second pin for connecting to top electrodes of the first and second MOSFET dies, a first row of carrier pins and a second row of carrier pins disposed in-line with the first and second pins respectively for the control die to mount thereon.
Public/Granted literature
- US20140361419A1 POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF Public/Granted day:2014-12-11
Information query
IPC分类:
