Invention Grant
- Patent Title: Temperature control of micromachined transducers
- Patent Title (中): 微加工传感器的温度控制
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Application No.: US12978762Application Date: 2010-12-27
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Publication No.: US08981624B2Publication Date: 2015-03-17
- Inventor: David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
- Applicant: David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L41/09
- IPC: H01L41/09 ; B81B3/00 ; G10K9/125 ; G10K9/18 ; H04R17/02 ; H04R31/00 ; H01L41/31
Abstract:
A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
Public/Granted literature
- US20110088234A1 TEMPERATURE CONTROL OF MICROMACHINED TRANSDUCERS Public/Granted day:2011-04-21
Information query
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