Invention Grant
US08981803B2 Method for cleaning a contact pad of a microstructure and corresponding cantilever contact probe and probe testing head 有权
清洁微结构接触垫和相应的悬臂接触探针和探头测试头的方法

  • Patent Title: Method for cleaning a contact pad of a microstructure and corresponding cantilever contact probe and probe testing head
  • Patent Title (中): 清洁微结构接触垫和相应的悬臂接触探针和探头测试头的方法
  • Application No.: US13661980
    Application Date: 2012-10-26
  • Publication No.: US08981803B2
    Publication Date: 2015-03-17
  • Inventor: Riccardo Vettori
  • Applicant: Technoprobe S.p.A.
  • Applicant Address: IT Cernusco Lombardone
  • Assignee: Technoprobe S.p.A.
  • Current Assignee: Technoprobe S.p.A.
  • Current Assignee Address: IT Cernusco Lombardone
  • Agency: Seed IP Law Group PLLC
  • Priority: ITMI2010A000724 20100428
  • Main IPC: G01R31/02
  • IPC: G01R31/02 G01R1/067 G01R31/28
Method for cleaning a contact pad of a microstructure and corresponding cantilever contact probe and probe testing head
Abstract:
A method for cleaning a contact pad of a microstructure or device to be tested when it is in electric contact with a measure apparatus, being obtained by electrically contacting a flexible probe with said contact pad. The method includes mechanically engaging a free end of the flexible probe in a manner that sticks the free end in the pad; and laterally flexing, by a tip charge, the flexible probe in a manner that keeps the free end stuck in the pad, so as to locally dig into a covering layer of the pad and realize a localized crushing thereof.
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