Invention Grant
- Patent Title: LED mounting substrate
- Patent Title (中): LED安装基板
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Application No.: US13508676Application Date: 2010-11-26
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Publication No.: US08985818B2Publication Date: 2015-03-24
- Inventor: Daisuke Kitagawa , Yoshinari Takayama , Ichiro Suehiro , Hideyuki Usui , Takashi Oda
- Applicant: Daisuke Kitagawa , Yoshinari Takayama , Ichiro Suehiro , Hideyuki Usui , Takashi Oda
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2009-268723 20091126
- International Application: PCT/JP2010/006922 WO 20101126
- International Announcement: WO2011/065016 WO 20110603
- Main IPC: H05K1/03
- IPC: H05K1/03 ; C08L27/18 ; H01L23/373 ; H01L33/60 ; H01L33/64 ; H05K3/00
Abstract:
The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.
Public/Granted literature
- US20120230043A1 LED MOUNTING SUBSTRATE Public/Granted day:2012-09-13
Information query
