发明授权
- 专利标题： Substrate processing apparatus, substrate processing method and storage medium
- 专利标题（中）： 基板处理装置，基板处理方法和存储介质
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申请号： US13611555申请日： 2012-09-12
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公开(公告)号： US08985929B2公开(公告)日： 2015-03-24
- 发明人: Suguru Enokida , Masahiro Nakaharada , Akira Miyata , Hidekazu Kiyama , Naruaki Iida
- 申请人： Suguru Enokida , Masahiro Nakaharada , Akira Miyata , Hidekazu Kiyama , Naruaki Iida
- 申请人地址： JP Minato-Ku
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Minato-Ku
- 代理机构： Burr & Brown, PLLC
- 优先权： JP2011-208097 20110922; JP2011-208100 20110922
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; H01L21/67 ; H01L21/687
摘要：
A substrate processing apparatus includes: a carrier block including first and second carrier placement units spaced apart in a right and left direction; a processing block having a layered structure in which a plurality of layered parts are vertically arranged, the layered parts each including a substrate transport mechanism for transporting a substrate and a processing module for processing a substrate; a tower unit including plural substrate placement units located at height positions where a substrate is transferred by the substrate transport mechanism of the layered part corresponding to the substrate placement unit; a first substrate transfer mechanism configured to transfer a substrate between the carrier on the first carrier placement unit and the substrate placement unit of the tower unit; and a second substrate transfer mechanism configured to transfer a substrate between the carrier on the second substrate placement unit and the substrate placement unit of the tower unit.
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