Invention Grant
US08987009B1 Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product
有权
用于在硅堆叠互连技术（SSIT）产品中跟踪插入器裸片的方法和装置
- Patent Title: Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product
- Patent Title (中): 用于在硅堆叠互连技术（SSIT）产品中跟踪插入器裸片的方法和装置
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Application No.: US13742010Application Date: 2013-01-15
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Publication No.: US08987009B1Publication Date: 2015-03-24
- Inventor: Cinti X. Chen , Myongseob Kim , Xiao-Yu Li , Mohsen H. Mardi
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent Gerald Chan; LeRoy D. Maunu; Lois D. Cartier
- Main IPC: H01L21/71
- IPC: H01L21/71 ; H01L21/98 ; H01L21/673 ; H01L21/66 ; H01L23/00
Abstract:
A method for tracking an interposer die of a stacked silicon interconnect technology (SSIT) product includes forming a plurality of dummy components on the interposer die, and modifying one or more of the plurality of dummy components on the interposer die to form a unique identifier for the interposer die. An apparatus for a stacked silicon interconnect technology (SSIT) product includes an interposer die, and a plurality of dummy components at the interposer die. One or more of the plurality of dummy components is modifiable to form a unique identifier for the interposer die.
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