Invention Grant
- Patent Title: Light emitting device and method of manufacturing the light emitting device
- Patent Title (中): 发光装置及其制造方法
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Application No.: US14152712Application Date: 2014-01-10
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Publication No.: US08987853B2Publication Date: 2015-03-24
- Inventor: Shinji Nishijima , Tomohide Miki , Hiroto Tamaki
- Applicant: Nichia Corporation
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Foley & Lardner LLP
- Priority: JP2009-248820 20091029
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L23/495 ; H05K5/00 ; H01L33/48 ; H01L33/52 ; H01L33/60

Abstract:
A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.
Public/Granted literature
- US20140191278A1 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE Public/Granted day:2014-07-10
Information query
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