Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
-
Application No.: US13109740Application Date: 2011-05-17
-
Publication No.: US08987897B2Publication Date: 2015-03-24
- Inventor: Kuei-Ti Chan , Tzu-Hung Lin , Ching-Liou Huang
- Applicant: Kuei-Ti Chan , Tzu-Hung Lin , Ching-Liou Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/522 ; H01L23/00 ; H01Q23/00 ; H01L23/525
Abstract:
The invention provides a semiconductor package. The semiconductor package includes a substrate. A first passivation layer is disposed on the substrate. An under bump metallurgy layer is disposed on the first passivation layer. A passive device is disposed on the under bump metallurgy layer.
Public/Granted literature
- US20120126368A1 Semiconductor Package Public/Granted day:2012-05-24
Information query
IPC分类:
