Invention Grant
US08987910B2 Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
有权
在印刷电路板和IC基板上获得铜线接合的钯表面光洁度的方法
- Patent Title: Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
- Patent Title (中): 在印刷电路板和IC基板上获得铜线接合的钯表面光洁度的方法
-
Application No.: US13996555Application Date: 2011-12-16
-
Publication No.: US08987910B2Publication Date: 2015-03-24
- Inventor: Mustafa Özkök , Gustavo Ramos , Arnd Kilian
- Applicant: Mustafa Özkök , Gustavo Ramos , Arnd Kilian
- Applicant Address: US DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: US DE Berlin
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP10196726 20101223
- International Application: PCT/EP2011/073120 WO 20111216
- International Announcement: WO2012/084736 WO 20120628
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44 ; H05K13/04 ; H01L23/498 ; H05K3/24 ; H01L23/00 ; H01B1/02 ; H05K1/09
Abstract:
The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
Public/Granted literature
Information query
IPC分类:
