A socket which enables occurrence of contact defects to be suppressed is provided. A socket 11 to which a test carrier 20, which has: a base film 32 on which bumps 324 are formed for contact with electrode pads 51 of a die 50; and external terminals 312 which are electrically connected to the bumps 324, is electrically connected comprises: contactors 125 which contact external terminals 312; and an elastic member 131 which pushes against bump-forming portions 32a and bump-surrounding portions 32b on the base film 32. The elastic member 131 has: a first elastic layer 132; and a second elastic layer 133 which is more flexible than the first elastic layer 132, and a second elastic layer 133 is laid over the first elastic layer 132 and contacts the base film 32.