发明授权
- 专利标题： Method for electrical connection between elements of a three-dimensional integrated structure and corresponding device
- 专利标题（中）： 三维一体化结构元件与相应装置之间的电连接方法
-
申请号： US13517819申请日： 2012-06-14
-
公开(公告)号： US08988893B2公开(公告)日： 2015-03-24
- 发明人: Pierre Bar , Sylvain Joblot , Jean-Francois Carpentier
- 申请人： Pierre Bar , Sylvain Joblot , Jean-Francois Carpentier
- 申请人地址： FR Montrouge
- 专利权人： STMicroelectronics SA
- 当前专利权人： STMicroelectronics SA
- 当前专利权人地址： FR Montrouge
- 代理机构： Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- 优先权： FR1155193 20110615
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H01L23/498 ; H01L21/48 ; H01L23/14
摘要：
A link device for three-dimensional integrated structure may include a module having a first end face designed to be in front of a first element of the structure, and a second end face designed to be placed in front of a second element of the structure. The two end faces may be substantially parallel, and the module including a substrate having a face substantially perpendicular to the two end faces and carrying an electrically conducting pattern formed in a metallization level on top of the face and enclosed in an insulating region. The electrically conducting pattern may include a first end part emerging onto the first end face and a second end part emerging onto the second end face and connected to the first end part.
公开/授权文献
信息查询
