Invention Grant
- Patent Title: CPU interconnect device
- Patent Title (中): CPU互连设备
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Application No.: US13707209Application Date: 2012-12-06
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Publication No.: US08990460B2Publication Date: 2015-03-24
- Inventor: Sheng Chang , Rongyu Yang , Xinyu Hou
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Huawei Technologies Co., Ltd.
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F13/40 ; G06F15/17 ; G06F13/42

Abstract:
The present disclosure provides a CPU interconnect device, the CPU interconnect device connects with a first CPU, which includes a quick path interconnect QPI interface and a serial deserial SerDes interface, the quick path interconnect QPI interface receives serial QPI data sent from a CPU, converts the received serial QPI data into a parallel QPI data, and outputs the parallel QPI data to the serial deserial SerDes interface; the serial deserial SerDes interface converts the parallel QPI data output by the QPI interface into a high-speed serial SerDes data and then send the high-speed serial SerDes data to another CPU interconnect device connected with another CPU. The defects of poor scalability, long data transmission delay, and a high cost of an existing interconnect system among CPUs can be solved.
Public/Granted literature
- US20130103875A1 CPU INTERCONNECT DEVICE Public/Granted day:2013-04-25
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