Invention Grant
US08990755B2 Defective artifact removal in photolithography masks corrected for optical proximity
有权
用于光学接近度校正的光刻掩模中的缺陷伪影去除
- Patent Title: Defective artifact removal in photolithography masks corrected for optical proximity
- Patent Title (中): 用于光学接近度校正的光刻掩模中的缺陷伪影去除
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Application No.: US13977481Application Date: 2011-12-29
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Publication No.: US08990755B2Publication Date: 2015-03-24
- Inventor: John A. Swanson , Stephan Wagner
- Applicant: John A. Swanson , Stephan Wagner
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- International Application: PCT/US2011/067946 WO 20111229
- International Announcement: WO2013/101115 WO 20130704
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F1/36 ; G03F1/72

Abstract:
Defective artifact removal is described in photolithography masks corrected for optical proximity. In one example a method is described in which partitions are identified in a mask design for independent optimization. The partitions are grouped and ordering into stages. The first stage is processed. Geometries are extracted from the periphery of the first stage partitions. The extracted geometries are added to the peripheries of second stage partitions. Then the second stage partitions are processed.
Public/Granted literature
- US20140195994A1 DEFECTIVE ARTIFACT REMOVAL IN PHOTOLITHOGRAPHY MASKS CORRECTED FOR OPTICAL PROXIMITY Public/Granted day:2014-07-10
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