Invention Grant
- Patent Title: RFID chip package and RFID tag
- Patent Title (中): RFID芯片封装和RFID标签
-
Application No.: US13792650Application Date: 2013-03-11
-
Publication No.: US08991713B2Publication Date: 2015-03-31
- Inventor: Yuya Dokai , Koji Shiroki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-005419 20110114
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/07 ; G06K19/077 ; H01Q1/22 ; H01Q7/00 ; H01Q9/28
Abstract:
An RFID chip package includes an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band and a power supply circuit connected to the RFID chip and including at least one inductance element. A reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0Ω.
Public/Granted literature
- US20130200162A1 RFID CHIP PACKAGE AND RFID TAG Public/Granted day:2013-08-08
Information query
